Junior Signal Integrity & Packaging Engineer

About the role

Annapurna Labs, the team behind AWS Graviton, is looking for a motivated junior engineer to join its Signal‑Integrity & Packaging (SIP) team. You will work on the external electrical interfaces of advanced ARM‑based server SoCs, collaborating with backend, system and layout teams.

Key responsibilities

• Develop and validate high‑speed interfaces such as PCIe, DDR and Ethernet from die‑level floor‑planning through package and PCB routing.
• Perform signal and power integrity modeling and simulations using industry‑standard SI/PI tools.
• Collaborate with backend and system teams to optimise pin‑out, package layout and PCB breakout schemes.

Required profile

• BSc in Electrical Engineering or a related field.
• Experience (up to 3 years) with board design or lab measurement of digital high‑speed interfaces.
• Familiarity with signal and power integrity simulation tools.

Required skills

• Knowledge of high‑speed interfaces: PCIe, DDR, Ethernet.
• Signal Integrity and Power Integrity analysis.
• Use of simulation/extraction tools such as HFSS, Sigrity, HSpice.
• Hands‑on experience with lab equipment (oscilloscope, spectrum analyzer).