IC Package Design Engineer

About the role

Cisco's Common Hardware Group builds hardware platforms central to the AI era, powering its Switching, Routing and Wireless products. As an IC Package Design Engineer you will contribute to complex ASIC package designs from early planning through implementation and tapeout, working with package design, layout, SI/PI and silicon teams to deliver high-speed, robust and manufacturable packages.

Key responsibilities

• Lead package design activities including planning, floorplanning, pinout optimization, stack-up definition and high-speed routing support.
• Collaborate with SI/PI, silicon floorplanning, layout and manufacturing teams to ensure high-quality package solutions.
• Support package implementation and work with layout designers so design intent matches physical implementation.
• Take part in technical investigations, design reviews and tradeoff discussions covering performance, manufacturability and schedule.
• Help develop and improve package design methodologies, flows and best practices.
• Contribute to debugging, issue resolution and package bring-up activities as needed.

Required profile

• Bachelor's degree in Electrical Engineering or a related field.
• 3+ years of experience in package, PCB or high-speed design engineering.
• Strong communication skills and ability to coordinate with cross-functional teams.

Required skills

• Strong understanding of high-speed signal design and power distribution networks (PDN).
• Familiarity with industry-standard EDA tools for layout and design.
• Preferred: experience with advanced packaging, interposers or multi-die systems, and knowledge of silicon floor planning, SI and PI.